Investigating the fracture of electronic boards in space systems under random vibrations

Document Type : Original Article

Authors
Zahra Khaji 1
Mahdi Fakoor 1
Saeed Shakhesi 2
1 Faculty of New Sciences and Technologies, University of Tehran, Tehran, Iran
2 Iranian Space Research Center Academic Staff
10.22034/jssta.2023.391116.1117
Abstract
The design of space operations must be done carefully, Because the smallest mistake in the design and construction of the spacecraft causes heavy financial losses. Electronic boards, as one of the most important components of electronic systems in any operation, must be designed and built in such a way that they can continue to function under the incoming loads. The strong levels of random vibrations that space equipment is exposed to can cause damage and fracture in electronic boards. The random vibration field applied to the electronic board can be modeled by mixed-mode I/II loading. Fracture of electronic packages often occur due to cracking in the joint between the electronic board and the solder under mixed-mode I/II loading. In this research, a new fracture criterion based on the maximum tangential stress is presented to predict the fracture for the interfacial crack between the electronic board and the solder. Based on the presented criterion, the direction and moment of crack initiation are predicted for the interfacial crack between isotropic and orthotropic materials. In this way, the fracture limit curve can be drawn. By comparing the presented criterion with the available experimental data in references, it can be concluded that the presented criterion has sufficient validity to evaluate the prediction of fracture in interfacial cracks between isotropic and orthotropic materials
Keywords
Electronic Board#Solder joints# Random vibration# Fracture#Interfacial crack
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  • Receive Date 04 April 2023
  • Revise Date 22 May 2023
  • Accept Date 26 July 2023